MIL-STD-883E
作者:标准资料网 时间:2024-04-30 00:39:04 浏览:9954
来源:标准资料网
MIL-STD-883E, DEPARTMENT OF DEFENSE TEST METHODS STANDARD: MICROCIRCUITS, TEST STANDARDS (31 DEC 1996) [S/S BY MIL-STD-883F]., This standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations, mechanical and electrical tests workmanship and training procedures and such other controls and constraints as have been deemed necessary to ensure a uniform level of quality and reliability suitable to the intended applications of those devices.
【英文标准名称】:StandardTestMethodforDropShatterTestforCoke
【原文标准名称】:焦炭跌落粉碎标准试验方法
【标准号】:ASTMD3038-1993
【标准状态】:现行
【国别】:美国
【发布日期】:1993
【实施或试行日期】:
【发布单位】:美国材料与试验协会(ASTM)
【起草单位】:ASTM
【标准类型】:()
【标准水平】:()
【中文主题词】:固体燃料;焦炭;燃料;跌落试验;试验
【英文主题词】:droptests;solidfuels;coke;testing;fuels
【摘要】:
【中国标准分类号】:H32
【国际标准分类号】:75_160_10
【页数】:5P;A4
【正文语种】:英语
Product Code:SAE ARP1575
Title:Surface Preparation and Priming of Aluminum Alloy Parts for High Durability Structural Adhesive Bonding, Hand Applied Phosphoric Acid Anodizing
Issuing Committee:Ams B Finishes Processes And Fluids Committee
Scope:This document describes a hand-applied, nontank, phosphoric acid anodizing process for surface preparation of aluminum alloys required to achieve optimum bondline durability for structural adhesive bonding. This surface preparation system is designed to be used where a metal bond repair is required on a component or assembly that cannot be immersed in a tank. This surface preparation system has been validated for use with 180 degrees F (82 degrees C) and 250 degrees F (121 degrees C) service, elastomer-modified, epoxy adhesive and corrosion-inhibiting primer. The process described herein is the result of extensive evaluation of structural and durability performance and detailed analysis of the individual bonding surfaces. While the process described herein was originally developed for use in the adhesive-bonding of parts, components, or assemblies for aircraft, it is applicable to nonaircraft bonding operations as well. The procedure is normally used in repair operations.
